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PIC Process Integration Engineer

Nokia

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  1. Why do you want to join Nokia?
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  3. How do you decide what to test, and what does good code review look like to you?
  4. Describe a time a deadline forced a trade-off in quality. What did you choose and why?
  5. How would you design an API for a feature you have worked on?

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The Photonic Integrated Circuit (PIC) group at Nokia is at the forefront of developing and producing the chips that power our terabit-scale digital optical transport networks. We’re looking for a driven and collaborative Process Integration / Fab Start-Up engineer to join our PIC Product Integration Team. We are seeking a highly motivated and technically skilled engineer to lead the bring-up and qualification of a new Indium Phosphide (InP) photonics semiconductor fabrication facility. This role is critical to establishing high-yield, scalable, and reliable photonic device manufacturing processes in a cutting-edge fab environment. The ideal candidate will have experience with InP or compound semiconductor process development, fab tool qualification, and yield improvement. BS/MS/PhD in Electrical Engineering, Materials Science, or related field. Hands-on experience in compound semiconductor fabrication, with a strong preference for InP-based photonics. Understanding of semiconductor process integration, yield improvement methodologies, and cleanroom practices. Experience with fab tool bring-up and qualification, including troubleshooting and maintenance support. Strong problem-solving skills, with a data-driven mindset and familiarity with tools like JMP, Python and MES/SPC software packages. Experience with SPC, Design for Manufacturing (DfM), and six-sigma principles for continuous improvement is a plus. Excellent communication and teamwork skills; able to work in a fast-paced startup or ramp-up environment.

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Listed on oraclehcm · posted 2026-11-04. ApplySarthi collects openings and links to application pages; the role is advertised by Nokia, not by us.