Staff Dry Etch Process Engineer

At Nokia Optical Networks , advanced photonic technologies become scalable products powering the world's communication infrastructure. Our team develops and manufactures cutting-edge Indium Phosphide (InP) photonic integrated circuits (PICs) , enabling coherent optics, high-speed transceivers, tunable lasers, optical amplifiers, and next-generation networking solutions. We work closely with device design, integration, manufacturing, equipment suppliers, and product teams to bring innovative concepts from research into high-volume production. As a Staff Dry Etch Process Engineer , you will develop, integrate, and optimize plasma etch processes used in the fabrication of advanced photonic devices. You will work hands-on with dry etch equipment, chamber hardware, consumables, masks, and metrology systems to improve critical dimensions, profile control, sidewall roughness, etch selectivity, yield, and manufacturability. You will collaborate across photolithography, thin films, wet etch, device engineering, integration, reliability, and manufacturing teams to support both technology development and production operations. This position provides opportunities to collaborate with Nokia R&D and manufacturing organizations globally, as well as equipment and material suppliers, to develop robust process solutions aligned with Nokia's optical networking technology roadmap. The role also supports adoption of advanced analytics, automation, and AI-enabled solutions to accelerate process development and operational excellence. M.S. or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, Mechanical Engineering, or a related technical field. B.S. degree with 5+ years of semiconductor, photonics, or optoelectronic process engineering experience will also be considered. Experience in semiconductor or photonic process development, integration, or sustaining engineering. Strong understanding of plasma etch fundamentals, chamber hardware, process characterization, and defect reduction methodologies. Experience with DOE planning, statistical analysis, SPC, and process capability improvement. Ability to work effectively across multidisciplinary engineering and manufacturing organizations. Strong ownership mindset with a demonstrated ability to independently drive projects, solve problems, and deliver results. Ability to prioritize and respond quickly to manufacturing challenges in a dynamic environment. Preferred Qualifications Hands-on experience with ICP, RIE, or other advanced dry etch systems used in compound semiconductor or photonic device manufacturing. Experience processing InP, GaAs, SiN, silicon photonics, or other III-V semiconductor technologies. Understanding of photonic device fabrication challenges, including waveguide profile control, etch depth uniformity, optical loss reduction, and dimensional variation control. Experience with optical metrology, SEM analysis, cross-section characterization, and defect inspection techniques. Knowledge of photonic integrated circuit fabrication, including lasers, modulators, optical amplifiers, and passive optical components. Experience supporting technology transfer, yield improvement, and high-volume manufacturing environments. Experience collaborating with equipment suppliers and external technology partners on process development initiatives.