Staff Assembly Process Engineer

Develop, sustain, and improve process yield for die attach, wirebond, inspection tools and/or process steps in the assembly of monolithically integrated optical circuits in 24x7 manufacturing and development facility. Focus on both process and tool ownership, process, equipment performance (MTBA, MTBF) and NPI. Skills / Experience / Knowledge Strong hands-on background in assembly technologies and processes for microelectronics manufacturing Hands-on operation and maintenance of assembly process tools and metrology equipment Technical expertise and ownership in die attach via solder or epoxy bonding on Micron2/Datacon EVO tool platform. Wafer fab or Assembly shop floor control systems Process engineering statistics background (SPC, DOE) Experience with Failure Analysis Material and Tool selection Plasma cleaning equipment and process Troubleshooting and resolving equipment problems Hands-on data analysis with JMP, MATLAB, or similar packages Experience in mentorship and training of operators, engineering technicians, and junior engineers Ability to work closely and coordinate activities with other functional groups. Good communication and project management skills Safety and quality-oriented mindset Knowledge & Experience Bachelor’s degree in electrical, Mechanical, Materials Engineering, or related field, plus 8 years of related experience, or master’s degree with 5 years of experience in semiconductor packaging & assembly technology in a manufacturing environment.