Silicon Photonics Packaging Engineer Co-op

Number of Positions: 2 Duration : 4 months Date : January 2027-June 2027 Location: Onsite in Sunnyvale, CA, Education Recommendations Current M.S. or Ph.D. student in electrical engineering, physics, applied physics, or other similar fields with an accredited university in the USA. Experience with package and process design/development from design to production. Knowledge of design for manufacturing, 2.5D/3D packaging, and TSVs. Experience with documentation of fabrication, inspection, and assembly processes. Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively. It would be nice if you also had: Understanding of optical epoxies, non-hermetic packaging, and high-volume packaging and thermal analysis of 2.5/ 3D packages. Experience in the semiconductor chip and wafer-level back-end processing, assembly, and/or packaging. Experience in high-speed electronics package design and/or laser package design. Experience with thermo-mechanical simulations using ANSYS or similar software. Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging. Familiarity with design and simulations of optical packaging using free space optics or fiber coupling.