Senior Product Manager

Product Manager Multi-Die Package / System-in-Package Products Job Description 1. Market Insight and Analysis · Closely monitor market dynamics and technology trends for highly integrated semiconductor products, including multi-die packages and system-in-package solutions that combine MCUs, gate drivers, power devices, power-management devices, and memory devices. · Analyze target applications, customer needs, competitor portfolios, supply-chain conditions, cost structures, and packaging technology roadmaps; regularly deliver market research, opportunity assessments, and product strategy recommendations. · Work closely with sales, field application, engineering, operations, and key customers to identify system-level pain points and translate them into differentiated integration opportunities and product concepts. 2. Product Definition and Management · Develop product roadmaps and portfolio plans for multi-die package products; define product positioning, target markets, application scenarios, competitive value propositions, and business priorities. · Lead system-level product definition across MCU, gate-driver, power-device, power-management, and memory functions, balancing electrical performance, thermal performance, reliability, package size, cost, manufacturability, and supply continuity. · Define package architecture, die partitioning, interconnection approach, pinout, power and signal integrity requirements, thermal design targets, test strategy, quality and reliability goals, and hardware/software ecosystem requirements in collaboration with R&D and packaging teams. · Draft and maintain MRDs, PRDs, product specifications, business plans, and project requirements, ensuring clear alignment across design, packaging, test, quality, operations, marketing, and sales teams. · Lead feasibility assessment, business-case development, project initiation, development reviews, risk management, product validation, qualification, and new product introduction to ensure on-time and high-quality delivery. · Take ownership of the full product lifecycle from concept and definition through mass production, portfolio optimization, change management, and end-of-life planning. 4. Partner and Supply-Chain Management · Coordinate internal and external resources across wafer suppliers, OSAT partners, substrate and lead-frame suppliers, test houses, and ecosystem partners to support product development and scalable production. · Participate in partner evaluation and selection, technical and commercial alignment, capacity planning, quality improvement, cost optimization, and supply-risk mitigation. 5. Data Analysis and Decision Support · Track product performance, design wins, revenue, gross margin, forecast, yield, quality, customer feedback, and competitive developments to evaluate business health and product competitiveness. · Use market and operational data to recommend roadmap adjustments, cost-reduction priorities, package or process improvements, and investment decisions to management. Qualifications 1. Education Background · Bachelor’s degree or above in Electronic Engineering, Microelectronics, Semiconductor Engineering, Materials Science, Automation, or a related discipline. A master’s degree or MBA is preferred. 2. Work Experience · Minimum 8 years of experience in semiconductor product management, product definition, system architecture, packaging engineering, application engineering, or related roles. · Proven hands-on experience with multi-die packaging or system-in-package products integrating two or more of the following device categories: MCU, gate driver, power device, power-management device, and memory device. · Demonstrated experience leading cross-functional semiconductor products from market opportunity and definition through development, qualification, mass production, and market launch. 3. Professional Skills · Product and System Expertise: Strong understanding of MCU architecture, gate-driver functions, power semiconductors, power-management devices, and memory technologies, including their system interactions and application trade-offs. · Packaging and Process Expertise: In-depth knowledge of semiconductor packaging architecture, die attach, interconnect, substrates or lead frames, thermal management, signal and power integrity, assembly, test, reliability, qualification, yield, and cost drivers. · Market Insight: Deep understanding of markets and applications where integration creates measurable value, with the ability to assess customer requirements, competitive alternatives, pricing, supply-chain factors, and business potential. · Documentation Skills: Proficient in developing MRDs, PRDs, product specifications, business plans, product roadmaps, competitive analyses, and executive decision materials. 4. Comprehensive Competencies · Communication & Collaboration: Strong cross-functional leadership and stakeholder-management skills, with the ability to align design, packaging, test, quality, operations, suppliers, sales, and customers around complex product decisions. · Commercial Acumen: Strong business-case, pricing, cost, margin, and portfolio-management capabilities, with sound judgment in balancing technical differentiation and commercial return. · English Proficiency: Fluent professional English, with the ability to read international technical documentation and participate effectively in cross-border technical and business discussions. More information about NXP in Greater China... #LI-67af