Senior Thermal-Mechanical Engineer — Aerospace Communications & Space Electronics
Nokia
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This role on the market
454 open communications roles across 140 companies are on ApplySarthi right now, most of them in Hyderabad (9), Bengaluru (4), Delhi NCR (2).
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What communications roles keep asking for: Stakeholder management (16%) — counted across their open postings here.
Nokia has 617 open roles listed here.
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Counted across 14 company job boards, updated as roles open and close.
Preparing for this interview
Interviews for communications roles keep coming back to Stakeholder management. Practise those questions before you sit with Nokia.
Questions you are likely to be asked
- Why do you want to join Nokia?
- How do you decide what to test, and what does good code review look like to you?
- Describe a time a deadline forced a trade-off in quality. What did you choose and why?
- How would you design an API for a feature you have worked on?
- What do you do when a production issue happens on your code?
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Practise the Senior Thermal-Mechanical Engineer — Aerospace Communications & Space Electronics at Nokia interview free →The Senior Thermal-Mechanical Engineer will play a crucial role in our team, leading the development and integration of aerospace and space communications equipment. With a primary focus on RF communications, this role involves designing thermal-mechanical solutions for high-performance electronics, including SpaceVPX/VITA-based systems. The successful candidate will have extensive experience in thermal management, structural analysis, and environmental qualification, ensuring our equipment meets the demanding requirements of aerospace and space environments. Bachelor's degree in Mechanical Engineering, Aerospace Engineering, or a related field is required. 7+ years of relevant thermal-mechanical or mechanical engineering experience, with a strong focus on aerospace or space applications. Expertise in thermal management of electronic, RF, and communications equipment is essential. Hands-on experience with SpaceVPX, VNX, and VPX architectures is highly desirable. Proficiency in FEA and thermal analysis tools, such as ANSYS or Abaqus, is a must. Demonstrated experience in TVAC, thermal cycling, shock, and vibration qualification testing. Strong understanding of mechanical packaging, GD&T, and manufacturing processes. Ability to work effectively in a multidisciplinary team, collaborating with RF, electrical, and systems engineers. Excellent problem-solving and analytical skills, with a track record of delivering complex engineering projects. U.S. Citizenship or Permanent Residency (Green Card) is strongly preferred, with authorization to work in the U.S.
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Listed on oraclehcm · posted 2026-08-26. ApplySarthi collects openings and links to application pages; the role is advertised by Nokia, not by us.