ApplySarthiMechanical Packaging Engineer Co-op
Nokia
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This role on the market
1,012 open mechanical roles across 91 companies are on ApplySarthi right now, most of them in Bengaluru (22), Delhi NCR (6), Mumbai (5).
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- Hardware Developer Engineer Intern (Mechanical) 2027 - San Jose, CAIBM
Nokia has 619 open roles listed here.
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Counted across 14 company job boards, updated as roles open and close.
Preparing for this interview
1,012 open mechanical roles are hiring right now across 91 companies, mostly in Bengaluru — so the questions repeat. Practise them before you sit with Nokia.
Questions you are likely to be asked
- Why do you want to join Nokia?
- What is your experience with Paid media? Tell me one thing you learned the hard way.
- How would you design an API for a feature you have worked on?
- What do you do when a production issue happens on your code?
- Walk me through a system you built. How was it designed, and what would you change now?
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Practise the Mechanical Packaging Engineer Co-op at Nokia interview free →Number of Positions: 1 Date: Jan 2027 - Apr 2027 Duration: 4 months Location: Onsite in Sunnyvale, CA or New York, NY EDUCATIONAL RECOMMENDATIONS Current M.S. or Ph.D. student in mechanical engineering, physics, or other similar fields or related field with an accredited school in US. Experience with 3D CAD design, tolerance analysis, and GD&T with SolidWorks or similar software. Experience with thermal and thermo-mechanical simulations using ANSYS or similar software. Experience with documentation of fabrication, inspection, and assembly processes. Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively. It would be nice if you also had: Knowledge of design for manufacturing of 2.5D/3D packaging. Experience in high-speed electronics package design and/or laser package design. Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging - or equivalent practical work experience. Familiarity with design and simulations of optical packaging using free space optics or fiber coupling.
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Listed on oraclehcm · posted 2026-10-16. ApplySarthi collects openings and links to application pages; the role is advertised by Nokia, not by us.