ApplySarthiMechanical Engineer Student
Nokia
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This role on the market
1,165 open mechanical roles across 120 companies are on ApplySarthi right now, most of them in Bengaluru (29), Delhi NCR (7), Mumbai (6).
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Nokia has 582 open roles listed here.
- FPGA Verification Engineer
- Software Supply Concept Owner
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- Automation Trainee
- Electrical Contract Manufacturer Support Engineer
Counted across 14 company job boards, updated as roles open and close.
Preparing for this interview
1,165 open mechanical roles are hiring right now across 120 companies, mostly in Bengaluru — so the questions repeat. Practise them before you sit with Nokia.
Questions you are likely to be asked
- Why do you want to join Nokia?
- Describe a time a deadline forced a trade-off in quality. What did you choose and why?
- How would you design an API for a feature you have worked on?
- What do you do when a production issue happens on your code?
- Walk me through a system you built. How was it designed, and what would you change now?
Prep Sarthi gives you a free mock interview: an AI interviewer asks you questions like these out loud, from your own CV and this job, and shows your score and your weakest answer.
Practise the Mechanical Engineer Student at Nokia interview free →Position: Mechanical Engineer Student Number of Position(s): 1 Duration: 4 Months Start Date: January 4, 2027 Location: Onsite - Ottawa, Canada Educational Recommendations: Currently enrolled in a mechanical engineering program with an accredited school in Canada. In this role, you will collaborate with a world-class team of engineers to support the design, modeling, and testing of advanced optical technologies. This position offers a unique opportunity to balance thermal, structural, and manufacturability requirements while gaining hands-on experience in CAD design, Finite Element Analysis (FEA), thermal modeling, and New Product Introduction (NPI) processes. You will work cross-functionally across global locations to help transition innovative concepts into reliable, high-performance products. You're a great fit if you have: Experience with optical transceiver packaging (e.g., QSFP, OSFP) and ASIC packaging. Knowledge of compliance, shock, and vibration testing for telecommunications applications. Familiarity with advanced substrate technologies (e.g., organic build-up, LTCC, HTCC, and high-performance PCB laminates). Basic knowledge of thermal modeling, FEA, and CAD design tools.
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Listed on oraclehcm · posted 2026-10-29. ApplySarthi collects openings and links to application pages; the role is advertised by Nokia, not by us.