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Hardware Development Engineer

Nokia

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Questions you are likely to be asked

  1. Why do you want to join Nokia?
  2. Describe a time a deadline forced a trade-off in quality. What did you choose and why?
  3. How would you design an API for a feature you have worked on?
  4. What do you do when a production issue happens on your code?
  5. Walk me through a system you built. How was it designed, and what would you change now?

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As an Hardware Development Engineer, you will play a crucial role in the NI ON PSE HW&TE GX Syst HW & CentEng 5 (L06) department. Your primary focus will be on thermal design, simulation, and optimization for a range of high-speed pluggable transceivers, ensuring they meet power, temperature, and reliability requirements. You will collaborate with various teams and drive thermal architecture decisions throughout the product development lifecycle. NILightpath B.E./B.Tech/M.E./M.Tech in Mechanical, Thermal, Aerospace Engineering, or related field. 3+ years of electronics cooling and thermal engineering experience. 2+ years of thermal design for pluggable optical modules (OSFP, QSFP-DD, CFP, SFP family). Strong understanding of thermal challenges in DSP/ASIC cooling, optical engines, and laser devices. Experience with FloTHERM and other thermal tools for thermal simulations and modeling. Ability to correlate simulation results with lab measurements and drive design improvements. Hands-on experience with thermal validation for optical transceivers or compact networking products. Proficiency in thermal validation tools and techniques, including thermocouples and IR imaging. Strong analytical skills, methodical approach, and excellent technical reporting abilities.

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Listed on oraclehcm · posted 2026-08-28. ApplySarthi collects openings and links to application pages; the role is advertised by Nokia, not by us.