Senior Thin Film Metrology Engineer

Job Details: Job Description: About the Group The MDCE (Manufacturing Development and Customer Engineering) organization is responsible for enabling advanced manufacturing capability, metrology readiness, and yield learning across Intel’s global high-volume manufacturing (HVM) fabs, including Arizona, Ireland, Israel, Oregon, and other global sites. As part of Intel’s IDM 2.0 strategy, MDCE plays a critical role in supporting rapid technology transitions, high volume manufacturing ramp up, and sustained manufacturing excellence for both internal products and external foundry customers. About the Role This requisition seeks a Senior Thin Film Metrology Engineer to support 18A (1278) technology within the Thin Film Metrology area. The engineer will be responsible for driving thin film metrology execution across the segment, including recipe development, process qualification, production support, tool ownership, and technical problem solving. The role requires close collaboration with fab, process, and technology development teams to ensure successful execution throughout the early HVM ramp and sustaining production phases, while supporting the Thin Film Metrology roadmap and strategic objectives. The selected candidate will work closely with fab module teams, Process Integration, Yield, and Technology Development (TD) organizations to ensure thin film metrology capability, readiness, and continuous improvement. Key Responsibilities Perform detailed data analysis using various statistical/data mining tools to identify the root cause of parametric mismatches and OCD model integrity. Provide technical guidance on thin film process monitoring, tool matching, and metrology optimization. Lead/participate in continuous improvement projects on products and processes for improved yield performance. Provide expertise on process flow segments and control all aspects analysis related to these areas. Lead/participate in multi-area problem solving teams to provide model expertise to troubleshoot complex yield problems. Design and implement metrology models to deliver quick, precise feedback on product integrity and resolve yield-impacting issues. Collaborate closely with: Technology Development teams Yield organizations Process Integration teams Fab module teams Drive thin film metrology readiness for 18A technology introductions into production fabs. Ensure alignment of metrology capability, sampling strategies, and tool readiness with manufacturing and technology requirements. Drive cross‑site alignment and best‑practice sharing across global manufacturing fabs. Execute new product introductions and enable design-technology co-optimization through participation in factory task forces and design of experiments Core Competencies Strong problem‑solving capability and communication skills, with the ability to distill complex technical information for diverse audiences. Proven ability to manage and execute multiple projects simultaneously, meeting tight deadlines without compromising quality. Track record of success working in matrixed organizations with competing priorities. Demonstrate experience in cross-functional teamwork and collaboration. Excellent verbal and written communication skills. Passion for innovation and driving meaningful results in a fast-paced environment Qualifications: Minimum Qualifications Bachelor's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or in a related engineering/science field. 4+ years of experience in thin film metrology techniques, applications and their interaction with high‑volume manufacturing. 4+ years of experience in advanced‑node semiconductor manufacturing, development or high-volume manufacturing. Working knowledge of data analysis and statistics; exposure to machine learning is a plus. Preferred Qualifications Post graduate degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or in a related engineering/science field. Experience working with OCD (optical critical dimension) model development. Why Join Intel MDCE? Intel offers an exceptional opportunity to work with cutting-edge technology in a collaborative and innovative environment. This position provides a unique platform to shape the future of Intel's semiconductor solutions while directly supporting the company's efforts to meet diverse industry needs and maintain leadership in high-volume manufacturing. Join us in driving the next generation of semiconductor manufacturing excellence and advancing Intel's position as a global technology leader. Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: US, Oregon, Hillsboro Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel . Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change. * ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.