R&D Engineer: Test Engineering Wafer Test, Final Module Test & Characterization

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Job Description: Development of device testing at wafer level, die level and module level More specific duties include the following: Definition of test requirements and test methods for our optoelectronic transceiver and sensor products as well as for our in-house mixed signal ASICs and sensor chips, which are used within these products. Development, bring up and debugging test hardware and software for evaluation, device characterization (bench) and production testing. This can be either completely in-house or in cooperation with external engineering partners. Design of test application PCBs, test sockets, probe cards. Handover of test solutions to the production site or to external test houses. Full characterization of the devices over corner conditions, according to specification. Evaluation, analysis and reporting of characterization results and production test results along with creation of respective reports. Close cooperation with IC-designers, product-designers and project leaders throughout the entire project phase. Optimization of productive test packages (wafer level or final module test) based on the analysis of characterization and test data in order to achieve cost-efficient test solutions. Required qualifications: Master’s Degree or PhD in Electrical Engineering, Physics or equivalent discipline with focus on semiconductor devices and/or electrical/optical testing and measurement technology. 3+ years of experience in semiconductor testing. Desired skills and expertise: Deep technical expertise in the area of testing and measurement technology as well as data analysis techniques. Experience with discrete test/measurement equipment (oscilloscope, SMU, spectrum analyzer, etc.). Ideally also familiar with ATE equipment from well-known manufacturers (e.g. Teradyne, Advantest, LTX, etc.). Good knowledge of wafer probers and different probe card technologies. Profound expertise of structured programming using common languages, e.g. Python, C++, LabVIEW, NI TestStand, Python, C#, Java, MATLAB or similar software and maybe special ATE programming languages. Experience using AI tools to support the execution of the tasks described above. Good technical background in semiconductors. Both a self-contained, accurate approach to work and a broad interest in interdisciplinary work at the interface of electronics, optics, fiber technology and communication systems. Project experience and ability to integrate into teams across different functions and locations. General Requirements: Spoken and written proficiency in English. Prepared to learn German and acquire German communication skills. Openness to new technical fields and a motivation to familiarize oneself with them. Interface to customers as well as to suppliers, travel requirement up to 20% of the time, depending on project requirements. Need to be a good team player. Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.