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Wafer Fab Process Engineer

Broadcom

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1,656 open process roles across 109 companies are on ApplySarthi right now, most of them in Mumbai (80), Pune (70), Bengaluru (53).

What process roles keep asking for: Agile (14%) — counted across their open postings here.

Broadcom has 378 open roles listed here.

Counted across 14 company job boards, updated as roles open and close.

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Questions you are likely to be asked

  1. Why do you want to join Broadcom?
  2. How do you decide what to test, and what does good code review look like to you?
  3. Describe a time a deadline forced a trade-off in quality. What did you choose and why?
  4. How would you design an API for a feature you have worked on?
  5. What do you do when a production issue happens on your code?

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Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Job Description: Job Summary Lead process development, optimization, and transfer to manufacturing to achieve yield, quality, cost, and reliability targets. Key Responsibilities Own and drive advanced process modules (thin film deposition - metal/passivation, wafer thinning, thermal - oxidation, diffusion, implantation). Lead yield improvement and defect reduction initiatives using statistical and DOE methodologies. Drive new process integration (NPI) and process transfer to high-volume manufacturing. Perform root cause analysis and implement robust corrective/preventive actions. Define process control plans, SPC strategies, and OCAP execution. Collaborate cross-functionally with equipment, integration, quality, and R&D teams. Mentor junior engineers and technicians. Interface with suppliers on process and material improvements. Qualifications Bachelor’s or Master’s degree in Engineering (Electrical, Chemical, Materials, or related). At least 5 years of semiconductor wafer fab process experience in thin film deposition - metal/passivation and/or thermal - oxidation, diffusion, implantation. Strong knowledge of SPC, DOE, FMEA, and statistical data analysis tools. Demonstrated leadership in cross-functional technical projects. Strong analytical, problem-solving, and communication skills Preferred PhD in Engineering (Electrical, Chemical, Materials, or related). Six Sigma certification (Green/Black Belt). Experience supporting 4" to 6" wafer scaling or equivalent manufacturing transition. Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

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Listed on workday · posted 2026-08-29. ApplySarthi collects openings and links to application pages; the role is advertised by Broadcom, not by us.