Silicon Packaging Design Engineer
Intel
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This role on the market
313 open packaging roles across 59 companies are on ApplySarthi right now, most of them in Bengaluru (7), Mumbai (3), Hyderabad (3).
- Amazon Robotics RDPI Embedded Software, Robotics Delivery and Packaging Innovation Amazon
- Senior Advanced Packaging Material Category Supplier Manager (HBM)Micron
- Sr. Associate Manufacturing Systems (Packaging)Amgen
- Packaging EngineerCat
- Packaging Engineer3M
What packaging roles keep asking for: Supply chain (26%), Python (13%) — counted across their open postings here.
Intel has 954 open roles listed here.
- Partner Marketing Manager
- Silicon Packaging Architectbengaluru
- Electrical Validation Engineer (Temporary position)
- Device Engineer
- Intern System Software Development Engineer
Counted across 14 company job boards, updated as roles open and close.
Preparing for this interview
Interviews for packaging roles keep coming back to Supply chain, Python. Practise those questions before you sit with Intel.
Questions you are likely to be asked
- Why do you want to join Intel?
- How would you design an API for a feature you have worked on?
- What do you do when a production issue happens on your code?
- Walk me through a system you built. How was it designed, and what would you change now?
- Tell me about a hard bug you tracked down. How did you find the cause?
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Practise the Silicon Packaging Design Engineer at Intel interview free →Job Details: Job Description: Define packaging solutions for highly innovative integrated circuits, meeting adequate mechanical, thermal and electrical performance with the goal to achieve lowest package and system level cost. Co-design with chip designer, system engineering and PCB design teams during the development stage to optimize pad layout and pin map for most cost effective package and system. Independently plan, design and develop quality custom lead frame/substrate/module with supporting electrical simulation to reduce cross-talk, IR drop, and noise issues of the device. Technical lead for implementing packaging solutions at OSAT assembly site and/or internal assembly site. Ensure optimized package design which meets the assembly design rules of the selected assembly site. Work with the assembly partner to mitigate any potential risk and improve situation to meet yield target within the project milestone requirement. Co-work with NPI manager to prepare assembly site readiness for continuous uninterrupted flow from wafer fab-out to quality packaged sample meeting the required NPI schedule. Maintain complete set of product specific packaging related drawings, and reports. Qualifications: Bachelor / Master degree in Electrical Engineering / Mechanical Engineering / Material Science with more than 10 years experience in the field of IC Packaging Design and Layout. Package design experience using Siemens Xpedition EDA tool set is a must. Understand performance and cost trade-offs for different layout and assembly rules. Extensive manufacturing process knowledge regarding wafer bumping, substrate and lead frame manufacturing and assembly of wire bond and flip chip packages is required. Practical knowledge of Signal integrity and Power integrity in PCB design will be an advantage. Possesses good analytical, communication and organization skills. Job Type: Intel Contract Employee Shift: Shift 1 (India) Primary Location: India, Bangalore Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change. * ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
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Listed on workday · posted 2026-10-26. ApplySarthi collects openings and links to application pages; the role is advertised by Intel, not by us.