Silicon Design and Validation Engineer

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Job Description: Broadcom is looking for a Silicon Design and Validation Engineer. In this highly visible role, you will perform design, verification and validation of analog and mixed-signal high-speed building blocks. You will collaborate with cross functional teams to launch ASIC products for data center networking. Qualifications include: M.Sc. or PhD. in Electrical Engineering or Computer Engineering with 6+ years of experience in analog and mixed signal IP design, verification and validation for high-speed data converters, SerDes and data center networking and optical I/O. Experience with design, validation and verification of analog front-end circuits, Trans-Impedance Amplifiers(TIA), PLLs, VCOs and clocking circuitry. Knowledge of development methodologies, design flows including EDA integration, foundry PDK and associated collaterals. Experience with bench test debug and validation of clock generation and timing IPs, data converters, TIAs, modulator drivers, clock and data recovery (CDR) and SerDes. Validation, verification and characterization of various control loops such as PLLs, LDOs. Deep understanding of signal integrity and power integrity for high-speed designs and experience with PI and SI measurements for correlation and debugging purposes. Experience in test development, debug, and reporting. Ability to work with Matlab or Python. Experience in assessing design bugs and recommending workarounds. Experience with measurement equipment such as DCO, oversampling/real time scopes, and network analyzers. Experience with RF and high speed probing is a plus. System level knowledge and deep understanding of current generation and next generation of optical and electrical high-speed I/Os Understanding of high-speed optical and electrical interconnect architectures and IEEE standards. Strong analytical thinking and problem-solving skills with excellent attention to details. It is a plus if the candidate has a good understanding of advanced packaging (2.5D / 3D) architectures. Highly Desired Qualifications: Strong written and verbal communication skills, with the specific ability to speak to various technical and management levels. Proactive, collaborative and creative approach to innovation, technical development and consensus facilitation to influence optimal project results. Excellent time and task management, and interpersonal skills. Willingness to travel when required. Additional Job Description: Compensation and Benefits The annual base salary range for this position is $120,000 - $192,000 As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements. Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence. Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.