ENGINEER, MTB PQA LAB

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary We are seeking a highly motivated Failure Analysis Engineer to join our Product Failure Analysis (PFA) Laboratory. The successful candidate will be responsible for conducting failure analysis, root cause investigations, and advanced package characterization to support product development and yield improvement. This role requires strong analytical skills, hands-on laboratory experience, and the ability to collaborate with cross-functional teams in a fast-paced semiconductor environment. Qualifications Education Bachelor's or Master's degree in: Materials Science & Engineering Electrical Engineering Electronics Engineering Mechanical Engineering Chemical Engineering Physics, Chemistry, or related technical disciplines Experience in one or more of the following areas is preferred: Wafer Fabrication Assembly and Packaging Product Engineering Yield Enhancement Failure Analysis Laboratory Advanced Packaging Technologies Responsibilities Perform electrical and physical failure analysis of semiconductor devices and packages. Conduct root cause investigations and provide technical recommendations. Develop and execute analytical plans to support engineering requests. Interpret analytical results and communicate findings effectively. Collaborate with Process, Product, Quality, Reliability, and Manufacturing teams. Generate technical reports and present findings to stakeholders. Support urgent customer and production-related failure analysis activities. Preferred Technical Skills Experience in one or more of the following: Failure Analysis Techniques Fault Isolation (FI) Voltage Contrast (VC) Delayer / Deprocessing Cross-section Analysis Die-level Failure Analysis Root Cause Analysis Equipment Experience FIB (Focused Ion Beam) SEM / EDS 3D X-ray / CT CSAM Optical Microscopy Hot Spot Analysis Emission Microscopy (EMMI) OBIRCH PHEMOS Sample Preparation Equipment Preferred Experience Candidates with experience in the following areas are highly desirable: HBM Failure Analysis Advanced Packaging Technologies TSV Analysis Micro-bump Inspection Hybrid Bonding Characterization Die Crack Analysis Delamination Investigation Thermal Failure Analysis Material Characterization Soft Skills Strong problem-solving and analytical skills Self-motivated and fast learner Ability to work independently and drive tasks to completion Strong communication and presentation skills Effective collaboration across global and cross-functional teams Ability to manage multiple priorities in a dynamic environment Nice to Have Experience with Python, JMP, Power BI, or data analytics tools Knowledge of HBM, 2.5D/3D packaging, or advanced packaging technologies Experience supporting new technology node development and qualification Technical report writing and presentation experience in English AI & Digital Skills (Preferred) Leverage AI-assisted tools and digital solutions to improve failure analysis efficiency, data interpretation, and technical decision-making. Apply data analytics, automation, and AI-enabled workflows to accelerate root cause investigation and problem-solving activities. Utilize AI-based tools to enhance technical reporting, knowledge management, and process optimization. Demonstrate a data-driven mindset with the ability to identify opportunities for workflow automation and productivity improvement. Experience with Python, JMP, Power BI, SQL, machine learning, or AI-assisted engineering tools is a plus. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_taiwan@micron.com . Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron. AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.