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Sr. Signal & Power Integrity Engineer, Annapurna Labs - AI Silicon Packaging

Annapurna Labs (U.S.) Inc.

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What integrity roles keep asking for: SQL (26%), Python (23%), R (13%) — counted across their open postings here.

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Questions you are likely to be asked

  1. Why do you want to join Annapurna Labs (U.S.) Inc.?
  2. When would you not use machine learning for a problem?
  3. Walk me through a model you built, from the data to how it was used.
  4. How did you know your model was actually good, and not just good on your test set?
  5. Tell me about a time the data was messy or wrong. What did you do?

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Annapurna Labs (our organization within Amazon) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short Basic qualifications: - Bachelor's degree in Electrical Engineering or a related field - 10+ years of experience in signal integrity, power integrity, and package design - Deep expertise in package SI/PI analysis: S-parameter extraction, PDN impedance analysis, IR drop, crosstalk, and return loss - Hands-on experience with EM simulation and SI/PI tools such as HFSS, Cadence Sigrity (PowerSI, PowerDC, Clarity), ADS, or equivalent - Strong understanding of advanced packaging technologies: 2.5D/3D-IC, silicon interposers, fan-out wafer-level packaging, RDL, TSVs, and microbump interconnects - Experience analyzing and modeling decoupling technologies including on-die MOM/MOS capacitors, deep trench capacitors (DTCs), and IPD capacitors within the package PDN - Proficiency in stack-up design and impedance control for multi-layer organic substrates and silicon interposers - Hands-on experience correlating package SI/PI simulations with lab measurements (TDR, VNA, oscilloscope) Preferred: - Master's degree in Electrical Engineering or a related field - 7+ years of experience, in signal integrity, power integrity, and package design - Experience with UCIe or other die-to-die interconnect standards in advanced packaging contexts - Familiarity with package-level thermal-aware PI analysis and electromigration considerations - Experience with EMC/EMI analysis and mitigation at the package level - Experience with high-speed serial protocols (PCIe Gen6/7, UCIe, or custom SerDes) at the package level - Knowledge of package co-design methodologies (chip-package-board co-simulation) - Experience with high-density fan-out or silicon bridge packaging (e.g., EMIB, CoWoS, or similar) - Experience with PDN target impedance methodology and frequency-domain decoupling optimization across die, package, and board domains Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status. Los Angeles County applicants: Job duties for this position include: work safely and cooperatively with other employees, supervisors, and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees, supervisors, and staff to ensure exceptional customer service; and follow all federal, state, and local laws and Company policies. Criminal history may have a direct, adverse, and negative relationship with some of the material job duties of this position. These include the duties and responsibilities listed above, as well as the abilities to adhere to company policies, exercise sound judgment, effectively manage stress and work safely and respectfully with others, exhibit trustworthiness and professionalism, and safeguard business operations and the Company’s reputation. Pursuant to the Los Angeles County Fair Chance Ordinance, we will consider for employment qualified applicants with arrest and conviction records. Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner. The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits . USA, CA, Cupertino - 213,000.00 - 287,500.00 USD annually USA, TX, Austin - 185,200.00 - 250,000.00 USD annually

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Listed on amazon · posted 2026-09-05. ApplySarthi collects openings and links to application pages; the role is advertised by Annapurna Labs (U.S.) Inc., not by us.