Sr. Package Engineer, Annapurna Labs - AI Silicon Packaging

Annapurna Labs designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago. Our custom chips, accelerators, Basic qualifications: - Experience coordinating between technical teams, peers and business stakeholders - Bachelor's in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, or 10+ years of industry experience in a related field - Expertise in at least one: substrate/PCB technology, interposer technology, or package and board assembly technology - Track record of driving technology development from concept through qualification Preferred: - Master's in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, or 8+ years of industry experience in a related field - Or PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, or 6+ years of industry experience in a related field - Familiarity with package-level SI/PI concepts (impedance control, PDN design, crosstalk-aware routing) sufficient to collaborate with SI/PI engineers - Experience with substrate/PCB architecture, materials, processes, yield, warpage, and DFM for advanced systems, including HDI, microvias, fine-line/space, and high-speed/power routing - Experience with interposer fabrication and DFM for 2.5D/3D systems (e.g., CoWoS-R/L), including RDL, TSV, silicon bridges, microbumps, and package floorplanning - Experience with package and board assembly processes, including flip-chip, thermal compression bonding, hybrid bonding, underfill, molding, TIM, and fine-pitch assembly. Co-packaged optics (CPO) experience is a plus. Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status. Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner. The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits . USA, AZ, Tempe - 185,200.00 - 250,000.00 USD annually USA, TX, Austin - 185,200.00 - 250,000.00 USD annually