Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging

Annapurna Labs (our organization within AWS) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short Basic qualifications: - Bachelor's degree in Electrical Engineering or a related field - Experience identifying bugs in architecture, algorithms, functionality, and performance with strong overall debugging skills - Experience verifying at multiple levels of logic from IP blocks to SoCs to full system testing - 5+ years of experience in IC package layout and physical design - Experience executing package designs from concept through tape out for multi-layer organic substrates or silicon interposers - Hands-on experience with package layout tools such as Cadence APD/SiP, Synopsys IC Packaging, Mentor Xpedition, or equivalent - Understanding of advanced packaging technologies: 2.5D/3D-IC, fan-out WLP, RDL, TSV, microbump, or silicon bridge interconnects - Working knowledge of package design rules, DFM constraints, and physical verification methodologies (DRC, connectivity checks) - Experience with bump map and ball map definition, escape routing strategies, and power/ground plane design - Good communication skills with the ability to work effectively across design, SI/PI, and manufacturing teams Preferred: - Master's degree in Electrical or Communications Engineering or a related field - Experience with formal verification techniques including abstraction and end-to-end checking - Experience with ARM and various DSP ISAs - Experience with current and upcoming RF standards in cellular (4G/5G NR), WiMAX, 802.11ad, microwave backhaul, or related broadband wireless standards - Experience with industry standard tools and scripting languages (Python or Perl) for automation - MS with 3+ years in IC package layout and physical design - Familiarity with substrate and interposer manufacturing processes, material properties, and their impact on design decisions - Exposure to chiplet-based or heterogeneous integration packaging architectures - Familiarity with package-level SI/PI concepts (impedance control, PDN layout, crosstalk-aware routing) sufficient to collaborate with SI/PI engineers - Experience developing automation scripts (Python, TCL, Skill, Ravel) for layout tasks or design rule checks - Exposure to working with OSAT partners on NPI builds or yield improvement efforts - Familiarity with high-bandwidth memory (HBM) integration in advanced packaging contexts Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status. Los Angeles County applicants: Job duties for this position include: work safely and cooperatively with other employees, supervisors, and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees, supervisors, and staff to ensure exceptional customer service; and follow all federal, state, and local laws and Company policies. Criminal history may have a direct, adverse, and negative relationship with some of the material job duties of this position. These include the duties and responsibilities listed above, as well as the abilities to adhere to company policies, exercise sound judgment, effectively manage stress and work safely and respectfully with others, exhibit trustworthiness and professionalism, and safeguard business operations and the Company’s reputation. Pursuant to the Los Angeles County Fair Chance Ordinance, we will consider for employment qualified applicants with arrest and conviction records. Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner. The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits . USA, AZ, Tempe - 153,600.00 - 215,000.00 USD annually USA, CA, Cupertino - 176,600.00 - 247,300.00 USD annually USA, TX, Austin - 153,600.00 - 215,000.00 USD annually